Public tender
Die-to-Wafer Bonder (IPMS-MRS14.1)
Fraunhofer-Gesellschaft - Einkauf B12
Details
- Submission deadline
- 24. Juli 2026
- Country
- Estimated value
- On request
- CPV codes
- 4989120542990000
Documents
- Leistungsverzeichnis
- Preisblatt
- Bewerbungsbedingungen
- Vertragsbedingungen
- Anlagen und Pläne
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