Public tender
Wirebonding System for SDU Microelectronics - reannouncement
Syddansk Universitet
Details
- Submission deadline
- 09. Nov. 2026
- Country
- Estimated value
- DKK 1,300,000
- CPV codes
- 31712100
Documents
- Leistungsverzeichnis
- Preisblatt
- Bewerbungsbedingungen
- Vertragsbedingungen
- Anlagen und Pläne
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